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Holistic and modern electronics production

We have modern machinery and excellently trained colleagues who can contribute their experience to the realization of your product.Whether assembly, painting or testing - we take full responsibility for your products!

We plan the processes for fully automatic, semi-automatic or manual production according to your individual requirements, for both large and small series. Our modern machinery includes numerous high-quality machines from well-known manufacturers and our own production technology. We continuously invest in additional equipment to meet your specific processing requirements. At FSM, you benefit from constantly optimized production processes and a high manufacturing standard. If required, we can fully assemble your devices - including packaging.

Our manufacturing processes cover a wide range of technologies:

SMD-Bestückung
 Ein Überblick über die Produktionshalle der FSM AG, in der moderne Maschinen und Produktionslinien zu sehen sind. Ein Mitarbeiter kontrolliert die Anlagen und sorgt für einen reibungslosen Ablauf.
Das Bild zeigt gegurtete elektronische Bauteile, die in einer Produktionsumgebung zur Platinenbestückung an der SMD-Linie benötigt werden. Die Bauteile sind in Gurtbändern organisiert und bereit für den automatisierten Fertigungsprozess.
Das Bild zeigt einen Nutzentrenner in einer Produktionsumgebung. Dieses Gerät wird verwendet, um Platinen präzise aus dem Nutzen zu trennen, nachdem sie bestückt und getestet wurden. Der Prozess stellt sicher, dass die Einzelplatinen ohne Beschädigungen für die weitere Verarbeitung oder den Einsatz vorbereitet werden.

SMD assembly

SMD assembly (SMD stands for “surface-mounted device”) is the dominant technology in PCB production today. This technology makes it possible to mount electronic components directly onto the surface of the PCBs and therefore contributes to very efficient processes.

Before assembly, a unique 2D QR code is lasered onto each PCB to ensure unambiguous tracking. See also the topic of traceability. The subsequent solder paste pressure is subsequently checked using SPI (Solder Paste Inspection) before component placement begins. The electronic components are preferably prepared on component reels so that the pick-and-place machine can remove them with vacuum pipettes and place them on the PCB.

In the subsequent reflow soldering process, the PCBs are gradually heated in a nitrogen atmosphere using hot air until the flux activates the metal surfaces, the solder paste melts and a secure connection is created during cooling. The final 3D AOI (Automatic Optical Inspection) uses image processing to check the quality of the placement of all components and their solder joints.

Depending on the subsequent process steps, the PCBs can be separated directly or after testing or painting using a fully automatic depaneling machine.

THT assembly
Das Bild zeigt eine Mitarbeiterin in einer Produktionsumgebung, die Leiterplatten in spezielle Trays einordnet. Diese Trays dienen dazu, die Platinen sicher zu lagern und für den nächsten Produktionsschritt vorzubereiten. Im Hintergrund sind weitere Trays mit Platinen zu sehen.
Das Bild zeigt eine Mitarbeiterin in einer Produktionsumgebung, die sorgfältig Bauteile auf eine Leiterplatte setzt. Umgeben von kleinen Behältern mit elektronischen Komponenten, konzentriert sie sich auf präzises Arbeiten, um die Funktionstüchtigkeit der Baugruppe sicherzustellen.

THT assembly

In addition to SMD assembly, THT assembly will remain an integral part of electronics production in the future. THT is the abbreviation for “Through Hole Technology”. THT assembly is always used when wired components are inserted into vias on the PCB and then connected to the PCB using a soldering process. THT assembly is particularly suitable for large components such as transformers or plug connections that are exposed to high mechanical loads or currents.

We use wave soldering as our preferred method due to its productivity and consistently high quality. The assembled PCBs are inserted into a special soldering frame and placed on the moving conveyor belt. The respective soldering frame is also provided with the necessary digital information. The soldering frame then moves into the system and the boards are preheated after the flux has been applied. During the soldering process, molten solder is pumped through perforated nozzles. The resulting wave of solder wets the underside of the circuit board and ensures a secure connection to the component connections. By masking specific areas, we can avoid SMT components and subsequent connection areas during soldering.

Depending on requirements or quantities, manual soldering is also part of our soldering process.

Press-fit technology

Press-fit technology

In addition to contacting components by soldering, we also have the know-how and the ability to mechanically assemble components using press-fit contacts. The press-fit contacts have excellent electrical and mechanical properties and therefore offer many possible applications - from power supply to electrical and mechanical connections.

Each pressing process of the hand lever press with air support is subject to digital control in order to meet the defined requirements.

Painting technology
 Das Bild zeigt eine lackierte Leiterplatte, die in den Händen eines Mitarbeiters gehalten wird. Die Schutzlackierung dient dazu, die empfindlichen elektronischen Bauteile und Leiterbahnen vor äußeren Einflüssen wie Feuchtigkeit, Staub und chemischen Substanzen zu schützen und die Langlebigkeit sowie Funktionalität der Platine zu gewährleisten.

Painting technology

The functionality of assembled PCBs can quickly deteriorate under the respective operating conditions. The applied coating protects the PCB from various hazards. A coating protects against moisture, dust, chemicals and other environmental influences. It also ensures protection against short circuits and other electrical problems.

The lacquer coating is applied automatically using a flexible automated dispensing/lacquering system with the option of using various nozzles and spray units. 

After application, the Twin-Cure protective coating system is cured in a UV system using the correct energy dose.

Montage

Montage

To complete our full range of electronics manufacturing services, device and component assembly is also one of our areas of expertise. The high vertical range of manufacture of our specially trained colleagues, coupled with the knowledge of our testing technology, enables us to assemble a wide variety of large and small series, including final electrical testing.

Thanks to our Supply Chain Management we also benefit from a holistic approach to appliance assembly and can implement customer requirements flexibly and quickly.

Mechanical processing
Mitarbeiterin führt präzise Arbeiten an einer technischen Vorrichtung in der Produktionsumgebung aus.

Mechanical processing

Our mechanical workshop enables us to quickly process housings, PVC and also FR4. Our specially developed test systems are manufactured, for example, on the M8Cube CNC milling machine. This has been specially developed for processing aluminum, non-ferrous metals and plastics at high speed and quality.

Further machines complement our machine park so that we can continue to manufacture products and special solutions quickly and flexibly.

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